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Simcenter 3D 
Thermofluid Simulation

Simcenter™ 3D software offers a complete solution for modeling nonlinear and transient heat transfer phenomena, taking into account conduction, convection, radiation and phase change. Dedicated thermal modeling resources are available, such as fast thermal connection methods, an extensive library of physical models, and a wide range of thermal loads and boundary conditions. The integrated CFD solution enables fast and accurate fluid flow simulation with tight coupling to the thermal model for conjugated heat transfer analysis of products at all stages of design development, limiting costly and time-consuming physical test cycles. These tools offer flexibility and ease of use while addressing complex thermal challenges.

Predict thermal performance for vehicles in orbit accurately and quickly.

Increase team collaboration and productivity with a thermal multiphysics analysis solution that is easily integrated into your design and engineering process.


Benefits of the solution

Get reliable thermal and flow information

​Easily handle

Quick creation and easy management of fluid domains

​Dominate complexity and productivity across industry verticals

Automation and customization to manage a wide range of models

Providing a platform for multidisciplinary simulation

  • Leverage the integrated Simcenter 3D environment to make rapid design changes and provide quick feedback on thermal performance

  • Use Simcenter Nastran to understand thermoelastic effects with coupled physics analysis

  • Minimize tedious rework and modeling errors with direct interfaces to ECAD systems

  • Analyze condensation, moisture, and dust particle transport in electronic systems

  • Predict thermal performance for vehicles in orbit accurately and quickly

  • Increase team collaboration and productivity with a thermal multiphysics analysis solution that is easily integrated into your design and engineering process

  • Accurately solve the Navier-Stokes equations that describe fluid motion

  • Perform conjugate heat transfer analysis on complex models using tight coupling with the Simcenter 3D Flow solver 

A pioneering tool in computational heat transfer modeling, Simcenter 3D Thermal Multiphysics from Siemens Digital Industries Software has been continuously developed for more than three decades. It has a complete library of elements, materials and physical models, linked to rich, high-fidelity solvers with a broad set of functionality. This is further enhanced by intuitive pre/post processing functionality for thermal, flow and multiphysics analysts.

​Using Simcenter 3D, thermal connections can be defined automatically between disjoint components, different meshes and nonconforming geometry. In addition, mesh congruence and proximity requirements are eliminated, allowing the user to build and resolve large assemblies quickly.

Automatic and fast extraction of the fluid domain using traditional Boolean operations, surface wrapping or displacer definition helps to improve the productivity of CFD analysis. Simcenter 3D can automatically join different fluid meshes at interfaces between different parts, which allows the user to quickly investigate many “ what if ” simulation scenarios” involving complex assemblies. All parts within any design assembly context can be independently joined together. Furthermore, the resulting disjoint fluid faces can be connected to form a single fluid domain at the time of resolution. Changes to individual parts can be quickly re-meshed into the assembly, thereby avoiding the time-consuming task of re-meshing the entire assembly.

Simcenter 3D capabilities for thermal simulation have been leveraged in vertical applications to meet industry-specific needs. Simcenter 3D Space Systems Thermal allows the user to model the thermal performance and characteristics of orbital and interplanetary vehicles. Simcenter 3D electronics cooling leverages thermal and flow solvers as well as NX™ PCB Exchange capabilities in an integrated multiphysics environment to simulate 3D airflow and thermofluid behavior in heat sensitive and compressed electronic systems.

Simcenter 3D for Thermal Multiphysics provides an extensible solver architecture that supports user subroutines, user plugins , expressions, and an open application programming interface (API) to automate and customize the product development workflow accordingly. with the needs of the sector.

The Simcenter 3D Thermal Multiphysics solution is part of a larger multidisciplinary simulation environment and is integrated with the Simcenter 3D Engineering Desktop at the core for centralized pre/post processing for all Simcenter 3D solutions. This integrated environment helps you achieve faster CAE processes and simplify multidisciplinary simulation, such as thermomechanical analyzes based on structural solutions, conjugate heat transfer problems that are coupled with flow solutions, and coupled structural thermal flow problems, where all three physics are intrinsically linked.


Industry applications

Automotive and transport

Aerospace and Defense

Electronics and consumer goods

Industrial machinery

Thermal multiphysics applications in Simcenter 3D include simulation and analysis for a variety of heat transfer and fluid flow problems in aerospace, automotive, electronics, power generation, process and other industries.

Simcenter 3D helps address a variety of analysis scenarios, such as under-the-hood thermal analysis (including porous blocking models), powertrain thermal management, and thermal response and temperatures in automotive lighting systems. Other automotive applications include thermal management in automotive lighting systems, cabin humidity and comfort analysis, exhaust gas mixture modeling, and transport of polluting species. Simcenter 3D offers a complete solution for the thermal design of electric vehicles, including batteries and enclosures.

Simcenter 3D includes the ability to model the thermal response of a single component for an overall aircraft system. Moisture transport along with film condensation modeling can be used to obtain estimates of passenger comfort. The aircraft engine turbine, compressor and entire engine can be modeled for thermal analysis or thermomechanical analysis coupled with Simcenter Nastran® software . Thermal dissipation of electrical components can be modeled using non-linear Joule heat capacity. Aerothermal or ablation analysis is an area of ​​strength.

Simcenter 3D can be leveraged to meet the design requirements of both compact and complex electronic systems. Examples include identifying recirculation zones and hot spots, predicting thermal response based on spatially variable and orthotropic capacitance and conductivity, and determining cooling strategies and heatsink modeling. Moisture and film condensation on electronic components can be easily simulated.

Simcenter 3D can be used to simulate a wide range of applications such as laser ablation and cutting , welding thermal response, mold cooling analysis, and phase change thermal analysis. Flow in rotating machines can be modeled using the rotary frame method with convection for 2D axisymmetric meshes and supported 3D meshes. In the cold chain industry, Simcenter 3D can be used to perform predictive modeling of the quality of frozen and temperature sensitive materials during transport and handling. Two-phase flow conditions, with constituents having significantly different densities and viscosities, are also supported.



Simcenter 3D Thermal provides heat transfer solutions and can simulate conduction, convection and radiation phenomena for complex products and large assemblies. A wide range of methods are available for sophisticated radiation analysis, advanced optical properties, radiative and electrical heating models, one-dimensional hydraulic network modeling, and models of advanced materials such as phase change, carbonization, and ablation. Thermal control and articulation devices can also be modeled. Simcenter 3D Thermal solver is based on a finite element and finite volume formulation to simulate heat transfer phenomena accurately and efficiently.



Simcenter 3D Flow is a computational fluid dynamics (CFD) solution that provides sophisticated tools for modeling and simulating fluid flow for complex parts and assemblies. Simcenter 3D Flow combines the power and accuracy of well-established control volume formulation with cell vertex formulation to efficiently discretize and solve fluid motion described by Navier-Stokes equations. Features cover internal or external fluid flow, including compressible and high-velocity flows, non-Newtonian fluids, heavy particle tracking, and multiple rotating reference frames.



Simcenter 3D Space Systems Thermal is the vertical application that provides a comprehensive set of tools to perform orbital thermal analysis in the Simcenter 3D environment. Simcenter 3D Space Systems Thermal helps solve engineering challenges early in the design process and is a valuable tool for predicting and understanding thermal physics for space, orbital, and interplanetary vehicles.



Simcenter 3D Electronic Systems Cooling software is an industry-specific vertical application that leverages Simcenter 3D Thermal Multiphysics solvers as well as NX™ software and NX PCB Exchange module capabilities in an integrated multiphysics environment. This allows you to simulate 3D airflow and thermofluid behavior in heat sensitive and compressed electronic systems.



Simcenter 3D's multiphysics thermal high-performance computing (HPC) leverages hardware systems configured as a multi-processor desktop or a multi-node cluster. One Simcenter 3D Thermal/Flow DMP license, along with prerequisite licenses, can be used to produce a solution on as many processors as are available.


Module benefits:

  • Solve complex heat transfer phenomena with a comprehensive set of modeling tools

  • Take advantage of the open architecture to integrate user threads and give greater control over the solution

  • Use parallelized thermal solver and view factor calculations (with GPU support) to increase solution efficiency and reduce total execution time

  • Use Simcenter Nastran Software to Understand Thermomechanical Effects of Coupled Physics Analysis

  • Provide full finite element method (FEM) assembly support to model complex systems

Main features:

  • Fully coupled conduction, radiation, and convection heat transfer simulation for steady-state and transient problems

  • Axisymmetric modeling, simplified 2D-3D modeling, and non-linear thermal properties
    Thermally connect disjoint and different mesh faces and edges

  • Post processing of live results and controlling solver parameters during solving

  • Advanced radiation methods such as deterministic and Monte Carlo ray tracing and non-grey multiband radiative heat transfer

  • Specific boundary conditions of dedicated turbomachinery combining pipelines and streams

  • Seamlessly send simulations to powerful remote machines using the built-in Simcenter 3D Remote Simulation feature


Module benefits:

  • Reduce expensive physical prototypes by simulating fluid flow in a virtual environment

  • Simplify processes that require a multidisciplinary simulation approach

  • Save time and avoid errors due to data transfer and results for multiphysics simulation

  • Easily trace the interface between two fluids in a " sloshing " problem

  • Efficient and accurate simulation of rotating machines

  • Couple 1D hydraulic networks with 3D flow models to simulate complex systems

Main features:

  • Simulate internal or external flow problems in turbulent, laminar and mixed flows

  • Accounts for forced, natural, and mixed convection

  • Connect different fluid meshes at interfaces between complex assemblies

  • Immersed limit method available for fast and easy CFD workflow

  • Post processing of live results and controlling solver parameters during solving

  • Industry standard turbulence models such as RNG k-epsilon, Realable k-epsilon, SST, k-omega and LES are supported

  • Filling and emptying of various species

  • Unidirectional and bidirectional fluid structure interaction with Simcenter Nastran

  • Seamlessly send simulations to powerful remote machines using the built-in Simcenter 3D Remote Simulation feature


Module benefits:

  • Predict thermal performance for vehicles in orbit accurately and quickly

  • Increase team collaboration and productivity with a thermal analysis solution that is easily integrated into your design and engineering process

  • Maximize process efficiency with a highly automated solution that requires no additional input files and performs analysis in a single pass

Main features:

  • Orbital heating model for all solar system planets

  • Transient Sight Factor recalculations with articulated geometries such as solar tracking solar panels and directional antennas

  • Support for advanced thermo-optical properties, including angular and spectral dependencies

  • Accurate modeling of solar radiation that takes into account atmospheric effects such as turbidity and ground reflection and shading

  • Multi-layer coating formulation for modeling multi-layer insulation, composite panels and thermal protection systems

  • Visualize simulation results in the Orbit Visualizer for a clear view of the evolution of thermal characteristics across orbits

  • Seamlessly send simulations to powerful remote machines using the built-in Simcenter 3D Remote Simulation feature

Module benefits:

  • Simulate 3D airflow and thermal behavior in electronic systems

  • Minimize tedious rework and modeling errors with direct interfaces to computer-aided design (ECAD) electrical systems

  • Transport condensation, moisture and dust particles in electronic systems

Características principais:

  • With NX PCB Exchange, fully 3D board designs can be sourced from leading printed circuit board (PCB) and flexible printed circuit (FPC) layout  software packages from companies such as Expedition, Zuken, Cadence, and Altium

  • Model the electrical network along with Joule heating with temperature-dependent resistivity

  • The immersed contour method provides a faster and more convenient workflow for fluid meshing

  • A catalog of fan curves is available ready-to-use (OOTB), which can be extended with additional data from the manufacturer


Module benefits:

  • Enjoy the flexibility of solving on a single machine or across a network or distributed cluster

  • Maximize the value of your hardware investments and greatly improve your solution

Main features:

  • Cores can be collocated on a single workstation, distributed across a local area network (LAN), or exist within a self-contained computing cluster

  • Limitations on the maximum number of cores are removed, allowing resolution speeds to increase or decrease based on the number of available cores, not the number of available licenses

  • Domain decomposition techniques are included to solve large-scale thermal models and flow models

  • Simcenter 3D Thermal Multiphysics solver features parallel computation of radiation visualization factors, radiative heating, and a thermal model solution

  • Enables GPU-based view factor computing and ray tracing for fast radiative heat transfer calculations



Simcenter 3D Thermal Multiphysics Thermal


Simcenter 3D Thermal Multiphysics Flow


Simcenter 3D Space Systems Thermal


Simcenter 3D Electronic Systems Cooling


Simcenter 3D Thermal Multiphysics HPC

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